BAS16DXV6T1G
vs
BAS16V
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
LITE-ON SEMICONDUCTOR CORP
|
| Part Package Code |
SOT-563, 6 LEAD
|
|
| Package Description |
LEAD FREE, PLASTIC, CASE 463A-01, 6 PIN
|
GREEN, PLASTIC PACKAGE-6
|
| Pin Count |
6
|
6
|
| Manufacturer Package Code |
463A-01
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Configuration |
SEPARATE, 2 ELEMENTS
|
SEPARATE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.715 V
|
|
| JESD-30 Code |
R-PDSO-F6
|
R-PDSO-F6
|
| JESD-609 Code |
e3
|
e3/e4
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
0.5 A
|
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.2 A
|
0.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
0.5 W
|
0.15 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
75 V
|
| Reverse Current-Max |
50 µA
|
|
| Reverse Recovery Time-Max |
0.006 µs
|
0.004 µs
|
| Reverse Test Voltage |
75 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
|
|
|
Compare BAS16DXV6T1G with alternatives
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