ADSP-BF533SBBC500 vs ADSP-BF533SKBCZ-6V feature comparison

ADSP-BF533SBBC500 Analog Devices Inc

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ADSP-BF533SKBCZ-6V Rochester Electronics LLC

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ANALOG DEVICES INC ROCHESTER ELECTRONICS INC
Part Package Code BGA BGA
Package Description MO-205AE, CSBGA-160 LFBGA,
Pin Count 160 160
Manufacturer Package Code BC-160-2
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer Analog Devices
Additional Feature ALSO REQUIRES 3V OR 3.3V SUPPLY ALSO REQUIRES 3V OR 3.3V SUPPLY
Address Bus Width 19 19
Barrel Shifter YES YES
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B160 S-PBGA-B160
JESD-609 Code e0 e1
Length 12 mm 12 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 160 160
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA160,14X14,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.7 mm 1.7 mm
Speed 500 MHz
Supply Voltage-Max 1.45 V 1.45 V
Supply Voltage-Min 0.8 V 0.8 V
Supply Voltage-Nom 1.2 V 1.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD SILVER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 2
Time@Peak Reflow Temperature-Max (s) 40

Compare ADSP-BF533SBBC500 with alternatives

Compare ADSP-BF533SKBCZ-6V with alternatives