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74HC273PW-Q100 vs 74HC273PW,112 feature comparison

74HC273PW-Q100 NXP Semiconductors

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74HC273PW,112 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP2
Package Description TSSOP, 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 6.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 225 ns 225 ns
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 4.4 mm
fmax-Min 24 MHz 24 MHz
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT360-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Logic » FF/Latches
Logic » FF/Latches

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