74HC273DB,118 vs HD74HC273RP-EL feature comparison

74HC273DB,118 NXP Semiconductors

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HD74HC273RP-EL Hitachi Ltd

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HITACHI LTD
Part Package Code SSOP2 SOIC
Package Description 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 SOP,
Pin Count 20 20
Manufacturer Package Code SOT339-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 7.2 mm 12.8 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 225 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 7.5 mm
fmax-Min 24 MHz
Base Number Matches 2 2

Compare 74HC273DB,118 with alternatives

Compare HD74HC273RP-EL with alternatives