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74HC273BQ-Q100X vs 74HC273D,652 feature comparison

74HC273BQ-Q100X NXP Semiconductors

Buy Now Datasheet

74HC273D,652 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN SOP
Package Description 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT764-1, DHVQFN-20 7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20
Pin Count 20 20
Manufacturer Package Code SOT764-1 SOT163-1
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PQCC-N20 R-PDSO-G20
Length 4.5 mm 12.8 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Propagation Delay (tpd) 225 ns 225 ns
Screening Level AEC-Q100
Seated Height-Max 1 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 2.5 mm 7.5 mm
fmax-Min 24 MHz 24 MHz
Base Number Matches 2 2
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.4
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Logic » FF/Latches
Logic » FF/Latches

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