Findchips: Compare 74HC02D,653 vs MM74HC02N

74HC02D,653 vs MM74HC02N feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	NATIONAL SEMICONDUCTOR CORP
Part Package Code	SOIC	DIP
Package Description	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14	DIP, DIP14,.3
Pin Count	14	14
Manufacturer Package Code	SOT108-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDIP-T14
JESD-609 Code	e4	e0
Length	8.65 mm	19.215 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NOR GATE	NOR GATE
Max I(ol)	0.004 A	0.004 A
Moisture Sensitivity Level	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	DIP
Package Equivalence Code	SOP14,.25	DIP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	IN-LINE
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	27 ns	23 ns
Propagation Delay (tpd)	27 ns	23 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Seated Height-Max	1.75 mm	5.08 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn/Pb)
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	1.27 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	3.9 mm	7.62 mm
Base Number Matches	1	3
	Logic » Gates	Logic » Gates