5962-8967601QC
vs
5962-8967602QC
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
| Ihs Manufacturer |
XTREME SEMICONDUCTOR
|
XTREME SEMICONDUCTOR
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
DIP,
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
4.5 V
|
4.5 V
|
| Analog Input Voltage-Min |
-4.5 V
|
-4.5 V
|
| Conversion Time-Max |
16.25 µs
|
16.25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T40
|
| JESD-609 Code |
e4
|
e4
|
| Linearity Error-Max (EL) |
0.0008%
|
0.0015%
|
| Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Qualified
|
Qualified
|
| Sample Rate |
0.05 MHz
|
0.05 MHz
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-8967601QC with alternatives
Compare 5962-8967602QC with alternatives