2N7002
vs
TN2524ND
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
SUPERTEX INC
|
| Part Package Code |
SOT-23
|
DIE
|
| Package Description |
SOT-23, 3 PIN
|
UNCASED CHIP, X-XUUC-N
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
3LD, SOT23, JEDEC TO-236, LOW PROFILE
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
60 V
|
240 V
|
| Drain Current-Max (ID) |
0.115 A
|
|
| Drain-source On Resistance-Max |
7.5 Ω
|
6 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
5 pF
|
25 pF
|
| JEDEC-95 Code |
TO-236AB
|
|
| JESD-30 Code |
R-PDSO-G3
|
X-XUUC-N
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
0.2 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
16
|
1
|
| Additional Feature |
|
LOGIC LEVEL COMPATIBLE, HIGH INPUT IMPEDANCE, LOW THRESHOLD
|
|
|
|
Compare 2N7002 with alternatives
Compare TN2524ND with alternatives