2N2222AUBC
vs
2N2222AUB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
CERAMIC PACKAGE-4
|
HERMETIC SEALED, CERAMIC, CERSOT-3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
30 Weeks
|
22 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Collector Current-Max (IC) |
0.8 A
|
0.8 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
30
|
30
|
| JESD-30 Code |
R-CDSO-N3
|
R-CDSO-N3
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Max (toff) |
300 ns
|
300 ns
|
| Turn-on Time-Max (ton) |
35 ns
|
35 ns
|
| Base Number Matches |
6
|
27
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-19500/255
|
|
|
|
Compare 2N2222AUBC with alternatives
Compare 2N2222AUB with alternatives