1N5819URHRX
vs
1N5819UR-1
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
BKC SEMICONDUCTORS INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
GLASS PACKAGE-2
|
HERMETIC SEALED, GLASS, LL41, MELF-2
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
HIGH RELIABILITY
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-213AB
|
DO-213AB
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
45 V
|
45 V
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Base Number Matches |
1
|
13
|
Rohs Code |
|
No
|
Factory Lead Time |
|
24 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
JESD-609 Code |
|
e0
|
Number of Phases |
|
1
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 1N5819URHRX with alternatives
Compare 1N5819UR-1 with alternatives