MPC564MZP56 vs MPC563MZP56R2 feature comparison

MPC564MZP56 NXP Semiconductors

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MPC563MZP56R2 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388 BGA, BGA388,26X26,40
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 16 Weeks
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of I/O Lines 16 16
Number of Terminals 388 388
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40 BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
RAM (bytes) 32768 32768
ROM (words) 524288 524288
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 56 MHz 56 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 388

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