MPC564MZP56 vs MPC561CZP40 feature comparison

MPC564MZP56 NXP Semiconductors

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MPC561CZP40 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 16 Weeks 16 Weeks
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 16 16
Number of Terminals 388 388
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40 BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
RAM (bytes) 32768 32768
ROM (words) 524288 458752
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 56 MHz 40 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Boundary Scan NO

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